| 摘要 |
A method for bonding first and second wafers by molecular adhesion. The method includes placing the wafers in an environment having a first pressure (P1) greater than a predetermined threshold pressure above which initiation of bonding wave propagation is prevented, bringing the first wafer and the second wafer into alignment and contact, and spontaneously initiating the propagation of a bonding wave between the wafers after they are in contact solely by reducing the pressure within the environment to a second pressure (P2) below the threshold pressure. |
