| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for processing semiconductor suppressing contamination in a processing chamber due to scattering of peeled thin films, thereby capable of improving a recovery rate of the thin films, and a method for manufacturing a semiconductor device using the apparatus for processing semiconductor.SOLUTION: An apparatus for processing semiconductor for processing a surface of a substrate. The apparatus includes: a nozzle 1 discharging a chemical solution for jetting, on the surface of the substrate; and a shower nozzle 2 disposed on the outer periphery of the nozzle 1, surrounding the vicinity of the chemical solution for jetting discharged from the nozzle 1, and discharging a shower liquid so as to form a liquid film reaching up to the surface of the substrate. |
