发明名称 |
HEAT SPREADER FOR USE WITHIN A PACKAGED SEMICONDUCTOR DEVICE |
摘要 |
A packaged semiconductor device, comprising a package substrate, an integrated circuit (IC) die mounted on the package substrate, and a heat spreader mounted on the package substrate. The heat spreader surrounds at least a portion of the IC die and includes a lid with a plurality of openings. An inner portion of the heat spreader includes a plurality of thermally conductive protrusions adjacent the die. |
申请公布号 |
US2014061894(A1) |
申请公布日期 |
2014.03.06 |
申请号 |
US201213600364 |
申请日期 |
2012.08.31 |
申请人 |
CHOPIN SHEILA F.;MATHEW VARUGHESE |
发明人 |
CHOPIN SHEILA F.;MATHEW VARUGHESE |
分类号 |
H01L23/34;F28F7/00;H01L21/56 |
主分类号 |
H01L23/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|