发明名称 |
LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
An LED package includes a first electrode, a second electrode adjacent to the first electrode, a molded body surrounding and encapsulating the first and second electrodes, and an LED die mounted on the second electrode. The molded body includes a reflecting cup located over the first and second electrodes and the reflecting cup defines a receiving cavity in a top face to receive the LED die. A first extension electrode protrudes sideward from the first electrode and a second extension electrode protrudes sideward from the second electrode. The first and second extension electrodes are exposed from an outer periphery of the molded body. A method for manufacturing the LED package is also provided. |
申请公布号 |
US2014061698(A1) |
申请公布日期 |
2014.03.06 |
申请号 |
US201313927777 |
申请日期 |
2013.06.26 |
申请人 |
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. |
发明人 |
LIN HOU-TE;CHANG CHAO-HSIUNG;CHEN PIN-CHUAN;CHEN LUNG-HSIN;TSENG WEN-LIANG |
分类号 |
H01L33/60;H01L33/54 |
主分类号 |
H01L33/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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