| 发明名称 |
METHOD FOR EXTREME ULTRAVIOLET ELECTROSTATIC CHUCK WITH REDUCED CLAMPING EFFECT |
| 摘要 |
The present disclosure provides one embodiment of a semiconductor structure. The semiconductor structure includes a semiconductor substrate having a front surface and a backside surface; integrated circuit features formed on the front surface of the semiconductor substrate; and a polycrystalline silicon layer disposed on the backside surface of the semiconductor substrate. |
| 申请公布号 |
US2014061655(A1) |
申请公布日期 |
2014.03.06 |
| 申请号 |
US201213602618 |
申请日期 |
2012.09.04 |
| 申请人 |
HSU CHIA-HAO;CHEN CHIA-CHEN;FU TZUNG-CHI;KAO TZU-WEI;LIN YU CHAO;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HSU CHIA-HAO;CHEN CHIA-CHEN;FU TZUNG-CHI;KAO TZU-WEI;LIN YU CHAO |
| 分类号 |
H01L21/20;H01L29/04 |
主分类号 |
H01L21/20 |
| 代理机构 |
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代理人 |
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