| 摘要 |
A semiconductor package including a substrate including an epoxy-based material, an image sensor chip mounted on the substrate, and an attaching part provided between the substrate and the image sensor chip may be provided. The attaching part may include a first attaching part, and a second attaching part provided around the first attaching part. The first attaching part may achieve high reliability of the semiconductor package in association with the second attaching part. The second attaching part may include a material having a low rigidity. Thus, it is possible to reduce or prevent warpage of the image sensor chip from occurring. Due to the presence of the second attaching part, a plane coverage ratio of the first attaching part relative to the image sensor chip can be reduced. Thus, the warpage of the image sensor chip can be reduced or prevented more effectively. |
