发明名称 PROCESSING ARRANGEMENT WITH TEMPERATURE CONDITIONING ARRANGEMENT AND METHOD OF PROCESSING A SUBSTRATE
摘要 <p>A substrate processing arrangement exhibits a thermal cavity with two reflective surfaces and a carbon heater for effectively heating substrates to temperatures of 750°C and more. It has been shown, that even substrates with low absorption properties in the infrared part of the spectrum (glas, silicon, sapphire) can be effectively heated by "sandwiching" a substrate and a heating element between two reflective surfaces, which can be established by a mirror and the target of a PVD source.</p>
申请公布号 WO2014032192(A1) 申请公布日期 2014.03.06
申请号 WO2013CH00148 申请日期 2013.08.22
申请人 OC OERLIKON BALZERS AG 发明人 ROHRMANN, HARTMUT;KRATZER, MARTIN
分类号 H01L21/67 主分类号 H01L21/67
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