HOUSING, ELECTRONIC ASSEMBLY, HOUSING COMPOSITE, METHOD FOR PRODUCING A HOUSING AND METHOD FOR PRODUCING AN ELECTRONIC ASSEMBLY

摘要

In various exemplary embodiments, a housing for an electronic component is provided. The housing comprises a lead frame section and molding material. The lead frame section is produced from an electrically conductive material and has a receiving region for receiving the electronic component and/or a contact region for contacting the electronic component. The lead frame section is embedded in the molding material. The molding material has at least one receiving recess in which the receiving region and/or the contact region is/are exposed. At least one stress reducing recess is formed in the molding material, said recess being free from the receiving region and/or the contact region.