| 发明名称 |
INTEGRATED CIRCUITS AND A METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT |
| 摘要 |
An integrated circuit is provided. The integrated circuit includes: a chip and encapsulation material covering at least three sides of the chip, the encapsulation material being formed from adhesive material. The integrated circuit includes a carrier adhered to the chip by means of the encapsulation material. |
| 申请公布号 |
US2014061878(A1) |
申请公布日期 |
2014.03.06 |
| 申请号 |
US201213602359 |
申请日期 |
2012.09.04 |
| 申请人 |
MAHLER JOACHIM;OSSOWSKI LUKAS;HOSSEINI KHALIL;NIKITIN IVAN;INFINEON TECHNOLOGIES AG |
发明人 |
MAHLER JOACHIM;OSSOWSKI LUKAS;HOSSEINI KHALIL;NIKITIN IVAN |
| 分类号 |
H01L23/31;H01L21/56;H01L23/495 |
主分类号 |
H01L23/31 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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