发明名称 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING CURABLE FILM, CURABLE FILM, ORGANIC EL DISPLAY DEVICE, AND LCD DEVICE
摘要 <p>A photosensitive resin composition represented by general formula (1), below, containing: [A] an alkali-soluble resin obtained by copolymerizing (A1) at least one substance selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic acid anhydrides, and (A2) an unsaturated compound containing an epoxy group; [B] a quinone diazide compound; and [C] a block isocyanate compound. The block isocyanate compound constitutes 0.1-10.0 mass% of the solid components of the photosensitive resin composition. (In formula (1), each R independently represents a C1-20 organic group.)</p>
申请公布号 WO2014034302(A1) 申请公布日期 2014.03.06
申请号 WO2013JP69162 申请日期 2013.07.12
申请人 FUJIFILM CORPORATION 发明人 KASHIWAGI DAISUKE
分类号 G03F7/023;G03F7/004;H01L21/027 主分类号 G03F7/023
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