| 摘要 |
PROBLEM TO BE SOLVED: To provide a nondestructive inspection method and device using a guide wave, capable of measuring a plate thickness without being affected by discontinuous parts such as weld zones and pipe branches in an inspection using the guide wave. SOLUTION: Transmitting guide wave probes 2a, 2b, and 2c, and receiving guide wave probes 2d, 2e, and 2f are installed across an inspection object range of piping 1. An arrival time of an S0 mode component is measured based on a received waveform A by a transmission method of the guide wave on the upstream side of an internal fluid of the piping 1 and a received waveform B by the transmission method of the guide wave on the downstream side. A computation unit 16 calculates the plate thickness of a measurement unit with the arrival time and a plate thickness-speed diagram based on a waveform recording unit 13, transmitting and receiving position input unit 14, and a plate thickness-speed diagram memory 15. COPYRIGHT: (C)2011,JPO&INPIT |
