| 摘要 |
<p>A laser cutting apparatus capable of properly cutting a workpiece having a large thickness with a laser beam. The laser cutting apparatus includes a gas laser oscillator; and an optical system including a collective lens and transmitting and collecting a laser beam generated in the gas laser oscillator to irradiate a workpiece with the laser beam. An index M 2 for evaluating a beam quality of the laser beam emerging from the optical system, with which the workpiece is irradiated, is in a range of 2.8 to 4.5; while the index M 2 is defined by a formula: M 2 = À × (dm) 2 / (4 × » × Zr); in which » is a wavelength of the laser beam; dm is a minimum beam diameter of the laser beam in a predetermined optical-path range including a focal point of the collective lens; and Zr is a distance between a first position on an optical axis, at which the minimum beam diameter dm is established, and a second position on the optical axis, at which a beam diameter "2 1/2 × dm" is established, in the laser beam in the predetermined optical-path range.</p> |
