| 摘要 |
A semiconductor component test chamber according to the present invention comprises: a burn-in board rack mounting part which accommodates multiple burn-in board parts where a test target semiconductor component is mounted; a system rack mounting part for arranging a system rack electrically connected to the burn-in board part; a heated air supply part for supplying heated air to the burn-in board rack mounting part; a cooling air supply part for supplying cooling air to the system rack mounting part; and a buffering chamber installed between the burn-in rack mounting part and the system rack mounting part. By the present invention, the system rack mounting part can be maintained in a room temperature in case the burn-in board rack mounting part is maintained in a high temperature, by arranging the buffering chamber between the burn-in board rack mounting part and the system rack mounting part. Also, the temperature in the inside of the test chamber can rise to a high temperature within faster time by stimulating circulation of the heated air around a burn-in board, by configuring that the burn-in board is mounted vertically in the test chamber. |
