发明名称 THERMAL SENSOR WITH THERMAL BARRIER
摘要 The invention provides a sensor element formed in a first substrate and having a thermal barrier disposed between the sensor element and a heat source provided elsewhere on the first substrate. The thermal barrier includes at least one pair of trenches formed within the first substrate, individual trenches of the pair being separated by a cavity.
申请公布号 EP2076743(B1) 申请公布日期 2014.03.05
申请号 EP20070821456 申请日期 2007.10.17
申请人 ANALOG DEVICES, INC. 发明人 LANE, WILLIAM;HYNES, EAMON
分类号 G01J5/06;H01L35/32 主分类号 G01J5/06
代理机构 代理人
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