SYSTEM FOR CUTTING FILM

摘要

The present invention relates to a film cutting system and, more specifically, to a film cutting system for sucking impurities and gas caused by reacting with chemicals when a film containing the chemicals is cut. The present invention can minimize a rise in production costs and the fraction defective of products because an additional process is not necessary by naturally transferring the impurities and the gas caused by the chemical reaction to a vacuum pump through a suction roller. The present invention can cut the film at high speed because suction force is applied to the suction roller to prevent the film from shaking. Also, the present invention can reduce costs required for the installation of a dust collection device because it does not need an existing dust collection device and can continuously maintain an output because the system does not stop operating.