PLASMA PROCESSING APPARATUS AND METHOD FOR PLASMA PROCESSING

摘要

The present invention provides a plasma processing apparatus which has time-modulated high frequency power which is controllable widely and precisely and a plasma processing method which uses the plasma processing apparatus. The plasma processing apparatus provided by the present invention includes: a vacuum container; a first high frequency power source for generating plasma in the vacuum container; a specimen plate which is arranged in the vacuum container and has a specimen arranged on the specimen plate; and a second high frequency power source which supplies high frequency power to the specimen plate. At least one between the first high frequency power source and the second high frequency power source supplies the time-modulated high frequency power, one of parameters which control the time modulation has two or more different control ranges, and one of the control ranges is a control range for performing a control of high precision. [Reference numerals] (AA) Repetition frequency area 1; (BB) Repetition frequency area 2; (CC) Duty ratio (%); (DD) Area A; (EE) Area B; (FF) Duty ratio area 2; (GG) Duty ratio area 1; (HH) Area C; (II) Repetition frequency (Hz); (JJ) Area D