METHOD OF MANUFACUTRUING SEMICONDUCTOR DEVICE STRUCTURE

摘要

Disclosed is a method for manufacturing a semiconductor device structure comprising the steps of: fixing the positions of two semiconductor devices on top of a plate, wherein the positions of each electrode of two semiconductor devices are fixed to face the plate; covering the semiconductor devices with an encapsulation material; separating the semiconductor devices covered with the encapsulation material from the plate; forming a groove in the encapsulation material between the semiconductor devices with a remover for the encapsulation material; and separating two semiconductor devices by cutting the encapsulation material in which the groove is formed.