发明名称
摘要 <p>The invention provides a laser processing device which is capable of forming a wide laser working groove and can carry out effective processing along processing lines. The laser processing device comprises a chuck workbench, a laser beam irradiating component and a process feeding component, wherein the laser beam irradiating component comprises a laser beam oscillating component for oscillating laser beams, and a condenser for gathering laser beams. The condenser comprises a laser beam separating component serially provided with separators with a wavelength plate and birefringent beam splitters and condenser lenses. The wavelength plate generates phase difference between the polarized light part of the laser light oscillated by the laser beam oscillating component and parallel to an optical axis and the polarized light part perpendicular to the optical axis. The birefringent beam splitters split laser light passing through the wavelength plate in a predetermined splitting angle, and the condenser lenses gather the laser lights split by the laser beam separating component. The birefringent beam splitters have different splitting angles.</p>
申请公布号 JP5431989(B2) 申请公布日期 2014.03.05
申请号 JP20100019009 申请日期 2010.01.29
申请人 发明人
分类号 B23K26/06;B23K26/064;B23K26/364;H01L21/301 主分类号 B23K26/06
代理机构 代理人
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