| 摘要 |
<p>A power module substrate having a heatsink, includes: a power module substrate (11) having an insulating substrate (12) having a first face (12a) and a second face (12b), a circuit layer (13) formed on the first face (12a), and a metal layer (14) formed on the second face (12b); and a heatsink (17) directly connected to the metal layer (14), cooling the power module substrate (11), wherein a ratio B/A is in the range defined by 1.5 ‰¦ B/A ‰¦ 20, where a thickness of the circuit layer (13) is represented as A, and a thickness of the metal layer (14) is represented as B.</p> |
