发明名称 |
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHODS THEREOF |
摘要 |
The present invention provides a method of manufacturing a semiconductor substrate that includes a substrate, a first semiconductor layer arranged on the substrate, a metallic material layer arranged on the first semiconductor layer, a second semiconductor layer arranged on the first semiconductor layer and the metallic material layer, and a cavity formed in the first semiconductor layer under the metallic material layer. |
申请公布号 |
EP2441097(A4) |
申请公布日期 |
2014.03.05 |
申请号 |
EP20100786378 |
申请日期 |
2010.06.10 |
申请人 |
SEOUL OPTO DEVICE CO., LTD. |
发明人 |
SAKAI, SHIRO |
分类号 |
H01L33/12;H01L21/02;H01L33/00;H01L33/20 |
主分类号 |
H01L33/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|