| 摘要 |
A wireless power transfer (WPT) enabled communication device, comprising: a plurality of modules configured to provide communication with communication devices according to a plurality of communication standards; a communication interface configured to communicatively couple the plurality of modules to one another, wherein a first module from among the plurality of modules is configured implement a communication standard from among the plurality of communication standards, a first portion of the first module being fabricated using a high voltage semiconductor process and a second portion of the first module being fabricated using a low voltage semiconductor process. Some of these high voltage and/or low voltage semiconductor process integrated circuits can be fabricated along with other high voltage and/or low voltage semiconductor process integrated circuits of other modules onto a single semiconductor substrate, chip, and/or die. This allows the low voltage semiconductor process integrated circuits and/or high voltage semiconductor process integrated circuits of one module to be combined with low voltage semiconductor process integrated circuits and/or high voltage semiconductor process integrated circuits of another module of the communication device. |
