METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES

摘要

A method and an apparatus for pressing a wafer-shaped article include a spin chuck which is changed to a driving axle between at least two discharge heights in a surrounding collector. A gas supply system includes a duct which supplies gas to the first inner region of the collector and a second inner region under the spin chuck respectively. Thereby, the inner pressure difference of the collector under and on the spin chuck can be controlled in order to prevent cross-contamination between the collector heights.