Packaged device designed to be exposed to environmental air and liquids and manufacturing method thereof

摘要

A packaged device, wherein at least one sensitive portion (7) of a chip (6) is enclosed in a chamber (4; 64; 74) formed by a package (3, 2; 33; 62, 63; 70, 73). The package has an air-permeable area (17) having a plurality of holes (15) and a liquid-repellent structure (16; 30; 56) so as to enable passage of air between an external environment and the chamber and block the passage of liquids.