| 摘要 |
The present invention discloses a method of packaging a light emitting diode (LED). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is arranged on a substrate. In some embodiments, the substrate may be a glass substrate, a silicone substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated on the LEDs. The phosphor layer is then cured. The tape and the substrate are removed after curing of the phosphor layer. A replacement tape is then attached to the LEDs. A dicing process is then performed to the LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process. |
