| 摘要 |
The present invention relates to a method for printing a peelable mask on a specific terminal of a printed circuit board (PCB) to prevent a solder from splattering, comprising the steps of: putting a PCB into a loader; printing a peelable mask on a specific terminal of the PCB; hardening the printed peelable mask on the PCB; putting the PCB on which the peelable mask has been hardened into the load again; printing a solder on the specific terminal of the PCB on which the peelable mask has been hardened; hardening the printed solder on the PCB on which the peelable mask has been hardened; attaching a chip on the PCB on which the solder has been hardened; and removing the peelable mask from the PCB on which the solder has been hardened. [Reference numerals] (AA) START; (BB) END; (S10) Install a peelable mask; (S100) Remove the peelable; (S20) Input a printed circuit board (PCB); (S30) Print a peelable; (S40) Harden the peelable; (S50) Install a solder mask; (S60) Input the PCB; (S70) Print a solder cream; (S80) Harden the solder cream; (S90) Attach an SMT chip |
