发明名称 Encapsulating sheet, light emitting diode device, and a method for producing the same
摘要 <p>An encapsulating sheet (1) is stuck to a substrate (14) mounted with a light emitting diode (11) to encapsulate the light emitting diode. The encapsulating sheet includes an encapsulating material layer (2) in which an embedding region (20) is defined, the embedding region for embedding the light emitting diode from one side surface of the encapsulating material layer; a first phosphor layer (4) laminated on the other side surface of the encapsulating material layer; and a second phosphor layer (5) laminated on one side surface of the encapsulating material layer so as to be spaced apart from the embedding region. </p>
申请公布号 EP2509122(A3) 申请公布日期 2014.03.05
申请号 EP20120162513 申请日期 2012.03.30
申请人 NITTO DENKO CORPORATION 发明人 KATAYAMA, HIROYUKI;KIMURA, RYUICHI;KONO, HIROKI
分类号 H01L33/50;H01L33/54 主分类号 H01L33/50
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