发明名称 Heat treatment method and components treated according to the method
摘要 Disclosed herein is a method of treating a component comprising solution treating the component for a period of about 4 to about 10 hours at a temperature of about 1750 to about 1850°F.; cooling the component to a temperature of about 1580 to about 1650°F. at an average rate of 1°F./min to about 25°F./min; stabilizing the component at about 1580 to about 1650°F. for a period of about 1 to about 10 hours; cooling the component to room temperature; precipitation aging the component at a first precipitation aging temperature of about 1275 to about 1375°F. for about 3 to about 15 hours; cooling the component at an average rate of 50 to about 150°F./hour to a second precipitation aging temperature of about 1100 to about 1200°F. for a time period of about 2 to about 15 hours; and cooling the component.
申请公布号 US8663404(B2) 申请公布日期 2014.03.04
申请号 US20070620897 申请日期 2007.01.08
申请人 YANG LING;SCHWANT ROBIN CARL;GENERAL ELECTRIC COMPANY 发明人 YANG LING;SCHWANT ROBIN CARL
分类号 C22F1/10;C21D6/02 主分类号 C22F1/10
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