发明名称 |
FLUXO PARASOLDA LIVRE DE CHUMBO E MÉTODO DE SOLDAGEM |
摘要 |
<p>A soldering flux which is suitable as a no-cleaning post flux in flow soldering and which can prevent the formation of whiskers which tends to occur when soldering electronic parts to a printed circuit board using a lead-free solder (such as Sn-3.0Ag-0.5Cu) having a higher Sn content and a higher melting point than the eutectic solder contains, in addition to a rosin as a base resin and an activator, 0.2 - 4 mass % of at least one compound selected from acid phosphate esters and derivatives thereof. The formation of whiskers can be more effectively prevented by carrying out soldering in a nitrogen atmosphere.</p> |
申请公布号 |
BRPI0718265(A2) |
申请公布日期 |
2014.03.04 |
申请号 |
BR2007PI18265 |
申请日期 |
2007.12.12 |
申请人 |
SENJU METAL INDUSTRY CO., LTD |
发明人 |
YUJI KAWAMATA;TAKASHI HAGIWARA;HIROYUKI YAMADA;KAZUYUKI HAMAMOTO |
分类号 |
B23K35/363;B23K1/00;B23K101/42;H05K3/34 |
主分类号 |
B23K35/363 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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