发明名称 FLUXO PARASOLDA LIVRE DE CHUMBO E MÉTODO DE SOLDAGEM
摘要 <p>A soldering flux which is suitable as a no-cleaning post flux in flow soldering and which can prevent the formation of whiskers which tends to occur when soldering electronic parts to a printed circuit board using a lead-free solder (such as Sn-3.0Ag-0.5Cu) having a higher Sn content and a higher melting point than the eutectic solder contains, in addition to a rosin as a base resin and an activator, 0.2 - 4 mass % of at least one compound selected from acid phosphate esters and derivatives thereof. The formation of whiskers can be more effectively prevented by carrying out soldering in a nitrogen atmosphere.</p>
申请公布号 BRPI0718265(A2) 申请公布日期 2014.03.04
申请号 BR2007PI18265 申请日期 2007.12.12
申请人 SENJU METAL INDUSTRY CO., LTD 发明人 YUJI KAWAMATA;TAKASHI HAGIWARA;HIROYUKI YAMADA;KAZUYUKI HAMAMOTO
分类号 B23K35/363;B23K1/00;B23K101/42;H05K3/34 主分类号 B23K35/363
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