THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE AND METHOD OF ALUMINUM NITRIDE INTERPOSER SUBSTRATE

摘要

The present invention relates to a 3D integrated circuit structure comprising a first metal circuit substrate; an interposer substrate mounted on the first metal circuit substrate and electrically connected to the same; and at least one semiconductor element mounted on the interposer substrate. The interposer substrate extends the lifespan of the semiconductor element by radiating heat generated when the semiconductor element is operating.