| 摘要 |
Disclosed are an electroless nickel-phosphorus alloy plating solution, and an electronic component using the same. According to an embodiment of the present invention, the electroless nickel-phosphorus alloy plating solution comprises a water-soluble nickel salt, a reducing agent, a stabilizer, a complexing agent, and a pH controlling agent, and comprises the below′chemical formula 1′.′The chemical formula 1′R1-′(CH2)l-NH-(CH2)m′n-R2 |
