Copper-Clad Laminate

摘要

1,191,072. Copper clad laminates. FMC CORP. 16 Jan., 1968 [23 Jan., 1967], No. 2248/68. Headings B5A and B5N. A method of making a copper-clad laminate comprises coating a copper sheet 10 with a thin film 12 of a polyphenylene oxide resin, heating the coated copper sheet to a temperature of from 100‹ to 170‹ C. for from 5 to 30 minutes, the heating being effected in the presence of air or dicumyl peroxide which is incorporated into the polyphenylene oxide before heating, laminating the coated surface of the copper at a temperature of at least 80‹ C. to a base 14 comprising a reinforcing material, e.g. a glass fibre mat or fabric or a mineral and/or fibrous filler and a thermosetting polymer which is a prepolymer of a diallyl ester of a dicarboxylic organic acid or an unsaturated polyester polymer, 10 to 50% (by weight based on the prepolymer or polyester) of a monomer which copolymerizes with the polymer and dicumyl peroxide catalyst in sufficient amount to convert the polymer-monomer mixture to the cured state at the laminating temperature. In one embodiment, a plurality of fibrous plies are impregnated with the specified composition and placed between two coated Copper sheets and the assembly heated in a press. In a further embodiment, a coated copper sheet is placed in a mould cavity, a moulding composition comprising the specified reactants and optionally a further coated copper sheet being applied thereto prior to closing the cavity and heating. Many conventional allyl ester prepolymers, polyesters and monomers are listed. Quantitative examples are given. The products may be used in the production of printed circuits.