发明名称 Semiconductor device
摘要 An element using a semiconductor layer is formed between wiring layers and, at the same time, a gate electrode is formed using a conductive material other than a material for wirings. A first wiring is embedded in a surface of a first wiring layer. A gate electrode is formed over the first wiring. The gate electrode is coupled to the first wiring. The gate electrode is formed by a process different from a process for the first wiring. Therefore, the gate electrode can be formed using a material other than a material for the first wiring. Further, a gate insulating film and a semiconductor layer are formed over the gate electrode.
申请公布号 US8664769(B2) 申请公布日期 2014.03.04
申请号 US201213552034 申请日期 2012.07.18
申请人 SUNAMURA HIROSHI;INOUE NAOYA;KANEKO KISHOU;RENESAS ELECTRONICS CORPORATION 发明人 SUNAMURA HIROSHI;INOUE NAOYA;KANEKO KISHOU
分类号 H01L23/52;H01L29/12 主分类号 H01L23/52
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