发明名称 |
Reinforcement structure for wafer-level camera module |
摘要 |
An example reinforcement structure for protecting a wafer-level camera module includes a top sheet element and a side sheet element. The top sheet element is to be disposed over a top surface of the camera module and includes a first opening for allowing light to pass through to the camera module. The side sheet element is coupled to the top sheet element for securing the reinforcement structure to a printed circuit board (PCB). A second opening in the side sheet element is included to allow an adhesive to be dispensed through the second opening to adhere the reinforcement structure to the camera module. |
申请公布号 |
US8665364(B2) |
申请公布日期 |
2014.03.04 |
申请号 |
US201113099905 |
申请日期 |
2011.05.03 |
申请人 |
LIN WEI-FENG;HO WEN-JEN;LEE CHI-KUEI;TSAI CHEN-WEI;OMNIVISION TECHNOLOGIES, INC. |
发明人 |
LIN WEI-FENG;HO WEN-JEN;LEE CHI-KUEI;TSAI CHEN-WEI |
分类号 |
H04N5/225;H01L31/0203 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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