发明名称 |
Wiring substrate and manufacturing method thereof |
摘要 |
A wiring substrate includes a wiring layer made of copper, an electrode layer made of copper, and an insulating layer arranged adjacent to the electrode layer. The wiring layer is stacked on the electrode layer and the insulating layer. The insulating layer and the wiring layer are stacked with an adhesive layer interposed between the insulating layer and the wiring layer. The electrode layer and the wiring layer are stacked with a copper alloy layer formed adjacent to the adhesive layer and interposed between the electrode layer and the wiring layer. |
申请公布号 |
US8664536(B2) |
申请公布日期 |
2014.03.04 |
申请号 |
US201113153590 |
申请日期 |
2011.06.06 |
申请人 |
SUNOHARA MASAHIRO;SUGANUMA SHIGEAKI;SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
SUNOHARA MASAHIRO;SUGANUMA SHIGEAKI |
分类号 |
H05K1/09 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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