发明名称 METHOD AND SYSTEM FOR CONTROLLING CRITICAL DIMENSION AND ROUGHNESS IN RESIST FEATURES
摘要 A method of treating a photoresist relief feature having an initial line roughness and an initial critical dimension. The method may include directing ions toward the photoresist in a first exposure at a first angular range and first dose rate and a that is configured to reduce the initial line roughness to a second line roughness. The method may also include directing ions toward the photoresist relief feature in a second exposure at a second ion dose rate greater than the first dose rate, wherein the second ion dose rate is configured to swell the photoresist relief feature.
申请公布号 KR20140025497(A) 申请公布日期 2014.03.04
申请号 KR20137031655 申请日期 2012.04.26
申请人 VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. 发明人 GODET LUDOVIC;LEAVITT CHRISTOPHER J.;OLSON JOSEPH;MARTIN PATRICK M.
分类号 H01J27/02;B01J19/08 主分类号 H01J27/02
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