| 摘要 |
<p>Provided is a high-frequency circuit module that has high mounting density. The high-frequency circuit module (100) includes a an RFIC (160) that performs transmission and reception processes for high-frequency signals, a power amplifier IC (155) that amplifiers a transmission signal from the RFIC (160), and a duplexer (110, 120) that separates a transmission signal outputted from the power amplifier IC (155) to an antenna and a reception signal inputted from the antenna to the RFIC (160), wherein any one or both of the RFIC (16) and the power amplifier IC (155) are embedded in a circuit substrate (200) and the duplexer (110, 120) is disposed between the RFIC (160) and the power amplifier IC (155).</p> |
