发明名称 |
FLEXIBLE SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, IMAGE DISPLAY DEVICE USING THE SAME, AND METHOD FOR MANUFACTURING THE IMAGE DISPLAY DEVICE |
摘要 |
There is provided a method for manufacturing a flexible semiconductor device. The method of the flexible semiconductor device according to the present invention comprises the steps of: (i) forming an insulating layer on one of principal surfaces of a metal foil; (ii) forming a semiconductor layer on the insulating layer, and then forming source and drain electrodes so that the source and drain electrodes contact with the semiconductor layer; (iii) forming a flexible film layer so that the flexible film layer covers the semiconductor layer and the source and drain electrodes; (iv) forming vias in the flexible film layer, and thereby a semiconductor device precursor is provided; and (v) subjecting the metal foil to a processing treatment, and thereby forming a gate electrode from the metal foil, wherein, in the step (v) of the processing treatment of the metal foil, the gate electrode is formed in a predetermined position by using at least one of the vias of the semiconductor device precursor as an alignment marker. |
申请公布号 |
KR20140024789(A) |
申请公布日期 |
2014.03.03 |
申请号 |
KR20127022898 |
申请日期 |
2012.02.21 |
申请人 |
PANASONIC CORPORATION |
发明人 |
SUZUKI TAKESHI;HIRANO KOICHI;MASUDA SHINOBU |
分类号 |
H01L21/336;G09F9/00;G09F9/30;H01L21/3213;H01L21/768 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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