发明名称 THREE DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE METHOD FOR MANUFACTURING THE SAME
摘要 <p>A three dimensional semiconductor memory device and a method for manufacturing the same are provided. The three dimensional semiconductor memory device includes an electrode structure where insulating patterns extended in the first direction on a substrate and horizontal electrodes are alternately stacked repeatedly; a semiconductor pillar connected to the substrate through the electrode structure; a charge storage layer between the semiconductor pillar and the electrode structure; a tunnel insulating layer between the charge storage layer and the semiconductor pillar; and a blocking insulating layer between the charge storage layer and the electrode structure. Each horizontal electrode includes a metal stopper formed between a gate electrode and the blocking insulating layer and the gate electrode.</p>
申请公布号 KR20140024632(A) 申请公布日期 2014.03.03
申请号 KR20120090849 申请日期 2012.08.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, JU HYUNG;SHIN, YOO CHEOL
分类号 H01L27/115;H01L21/8247 主分类号 H01L27/115
代理机构 代理人
主权项
地址