发明名称 |
THREE DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE METHOD FOR MANUFACTURING THE SAME |
摘要 |
<p>A three dimensional semiconductor memory device and a method for manufacturing the same are provided. The three dimensional semiconductor memory device includes an electrode structure where insulating patterns extended in the first direction on a substrate and horizontal electrodes are alternately stacked repeatedly; a semiconductor pillar connected to the substrate through the electrode structure; a charge storage layer between the semiconductor pillar and the electrode structure; a tunnel insulating layer between the charge storage layer and the semiconductor pillar; and a blocking insulating layer between the charge storage layer and the electrode structure. Each horizontal electrode includes a metal stopper formed between a gate electrode and the blocking insulating layer and the gate electrode.</p> |
申请公布号 |
KR20140024632(A) |
申请公布日期 |
2014.03.03 |
申请号 |
KR20120090849 |
申请日期 |
2012.08.20 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, JU HYUNG;SHIN, YOO CHEOL |
分类号 |
H01L27/115;H01L21/8247 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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