| 摘要 |
In one embodiment, a semiconductor die arranges a semiconductor wafer on a corresponding carrier tape while the carrier tape is adjacent to a backside metal layer, exposes the backside metal layer in singulation lines by forming the singulation lines through the semiconductor wafer, and removing the backside metal layer from the singulation lines by fluid-processing the semiconductor wafer. Therefore, the semiconductor die is singulated from the semiconductor wafer having the backside metal layer. |
