| 摘要 |
<p>Security element (10), preferably suitable for use in electrical and/or electronic circuits assembled in multi-layered technique, comprises a circuit board material usable in a multi-layer technology, where the circuit board material is coated with a metal and/or a metal alloy (15) and is generated from the security material (12) by means of e.g. photolithographic technique and followed by etching and engraving process. The printed circuit board substrate material (11), on which the security material is formed, consists of at least a high thermally stable, electrically insulating material. Security element (10), preferably suitable for use in electrical and/or electronic circuits assembled in multi-layered technique, comprises a circuit board material usable in a multi-layer technology, where the circuit board material is coated with a metal and/or a metal alloy (15) and is generated from the security material (12) by means of photolithographic and/or typographical imaging technique and followed by etching and engraving process. The circuit board substrate material (11), on which the security material is formed, consists of at least a high thermally stable, electrically insulating material. At least these thermal expansion coefficient runs in the analogous of the thermal expansion coefficient of the metal or metal alloy, from which the security material is formed.</p> |
