| 摘要 |
<p>IT IS TO IMPROVE THE STORAGE STABILITY OF A SEALANT, TO RETAIN THE FLOWABILITY OF THE SEALANT WHEN SEALING, AND TO ACHIEVE AN EFFECTIVE CURING RATE OF THE SEALANT BY HEATING TO BE APPLICABLE AS A SEALANT FOR DELICATE SEMICONDUCTORS. IT IS AN EPOXY RESIN COMPOSITION FOR SEALING A SEMICONDUCTOR, COMPRISING THE FOLLOWING COMPONENT (A) AND COMPONENT (B). (A) AN EPOXY RESIN, (B) A CLATHRATE COMPLEX COMPRISING (B1) AN AROMATIC CARBOXYLIC ACID COMPOUND, AND (B2) AT LEAST ONE IMIDAZOLE COMPOUND REPRESENTED BY FORMULA (II) (WHEREIN R2 REPRESENTS A HYDROGEN ATOM, ETC.; R3 TO R5 REPRESENT A HYDROGEN ATOM, ETC.).</p> |
