| 摘要 |
Provided is a hybrid relay wherein a semiconductor switch can be prevented from reaching a high temperature. The hybrid relay comprises a mechanical contact switch (12) the contact of which is opened/closed by a driving unit, and a semiconductor switch (13) that is connected in parallel with the mechanical contact switch (12). The hybrid relay also has a first power feeding comprising the mechanical contact switch (12) and a second power feeding path comprising the semiconductor switch (13) connected in parallel, as power feeding paths for supplying power to a load from a power supply. The hybrid relay also comprises a thermal fuse (F1), for example, as a safety circuit section for opening the power feeding path when the temperature of the semiconductor switch becomes equal to or more than a prescribed temperature. |
