| 摘要 |
The present invention relates to a magazine for storing a semiconductor package and more particularly, to a magazine for storing a semiconductor package, which is to prevent the separation of strip materials layered inside a magazine main body. Provided in the present invention is the magazine for storing a semiconductor package, which adopts a hinge structure in a spring method capable of maintaining a closed state using a spring whose locking device is elastic in a vertical direction. One end of the hinge structure is fixated to the top of the magazine main body to be rotated and the other end of the hinge structure is selectively hung on or released from the bottom of one open side of the magazine main body in a free end shape, thereby simplifying the overall structure of the locking device in the magazine and maximally securing a contact area with the strip materials. In addition, the magazine for storing a semiconductor package provided in the present invention can stably maintain the hanging state even when a hanging device frequently collides with the strip materials layered inside the magazine main body during the movement. |
