| 摘要 |
PROBLEM TO BE SOLVED: To provide a high density wiring board capable of transmitting a high frequency signal at low loss.SOLUTION: A wiring board consists of a plurality of: semiconductor element connection pads 10 having a pair 10P of semiconductor element connection pads for signal formed on an insulating layer 7 of a surface layer; a pair 12P of belt-like wiring conductors formed on an insulating layer 7 of an inner layer, having a connection edge connected to the pads 10P through a via hole 6 just below semiconductor element connection pads 10P for signal and parallel extension parts 12A extending parallel to each other from a vicinity of the connection edge on the insulating layer 7 of the inner layer; and a ground or power supply conductor layers G1 to G5. On the ground or power supply conductor layers G1 to G5, openings B from the connection edge of the pair 12P of the belt-like wiring conductors to a part of the parallel extension part 12A are formed at a length less than 1/16 of the length of the signal transmitting the pair 12P of the belt-like wiring conductors. |
