CHEMICAL MECHANICAL POLISHING COMPOSITION COMPRISING NON-IONIC SURFACTANT AND AROMATIC COMPOUND COMPRISING AT LEAST ONE ACID GROUP

摘要

A chemical mechanical polishing composition comprising: (A) inorganic particles, organic particles, or a mixture or composite thereof, wherein the particles are cocoon-shaped, (B) a non-ionic surfactant, (C) an aromatic compound comprising at least one acid group, or a salt thereof, and (M) an aqueous medium. A process for the manufacture of semiconductor devices comprising the chemical mechanical polishing of a substrate in the presence of a CMP composition and the use of CMP composition in the semiconductor industry are also provided.