METHOD FOR MANUFACTURING PACKAGE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a package with excellent joint strength and high airtightness, a method for manufacturing an electronic device, and an electronic device.SOLUTION: A method for manufacturing a package comprises the steps of: preparing a base substrate 210 provided with a low-melting glass 270 and a lid 250; defoaming the low-melting glass 270 by heating the low-melting glass 270 at a temperature not less than a flow point under a reduced-pressure atmosphere; and superposing the lid 250 on the base substrate 210 via the low-melting glass 270 and then bonding the base substrate 210 and the lid 250 by heating the low-melting glass 270 at a temperature not less than the flow point under the reduced-pressure atmosphere.