| 摘要 |
PROBLEM TO BE SOLVED: To facilitate a mounting process and improve reliability in a power semiconductor module.SOLUTION: A power semiconductor module comprises first and second conductor plates on which power semiconductor elements are mounted, respectively, and a wiring board on which driving elements for driving the power semiconductor elements are mounted. In the power semiconductor module, when projected from a direction perpendicular to an opposite surface of the first conductor plate, which is opposite to the power semiconductor element, the wiring board is arranged in such a manner that a part of a projected part of the wiring board overlaps a projected part of the first conductor plate, and bonded to the first conductor plate, and the driving elements and wiring conductors are arranged in such a manner that projected parts of the driving elements and the wiring conductors do not overlap projected parts of the first conductor plate and second conductor plate. |
