| 发明名称 |
WAFER SUPPORT DEVICE |
| 摘要 |
A wafer support device is provided. The wafer support device includes a plurality of support portions; and a bottom area located among the support portions, wherein the bottom area has a protective layer formed thereon. A method for processing a working surface of a wafer support device is also provided. |
| 申请公布号 |
US2014057052(A1) |
申请公布日期 |
2014.02.27 |
| 申请号 |
US201213593479 |
申请日期 |
2012.08.23 |
| 申请人 |
CHENG TIEN-CHIH;ZHANG YING;SUEN SHU-HUEI;KAO CHEN-CHIAO;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHENG TIEN-CHIH;ZHANG YING;SUEN SHU-HUEI;KAO CHEN-CHIAO |
| 分类号 |
B05C13/00;B05C11/00;B05D1/02;B05D3/12;B23B31/28 |
主分类号 |
B05C13/00 |
| 代理机构 |
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