CURABLE RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a curable resin composition from which a cured product having excellent heat resistance, exhibiting little change in heat resistance after a thermal history, and having excellent resistance to moisture and soldering is obtained, and to provide a cured product obtained by curing the same and a printed wiring board.SOLUTION: The curable resin composition essentially contains a naphthalene skeleton-containing epoxy compound (A) represented by structural formula (i) and a phenol resin (B) having a resin structure in which a naphthol skeleton (n) and a naphthoquinone skeleton (q) are bonded via a methylene bond.