发明名称 POLISHING COMPOSITION, POLISHING COMPOSITION MANUFACTURING METHOD AND SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD USING POLISHING COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polishing composition which can inhibit adherence of particles on a polished surface of a polishing object.SOLUTION: A polishing composition contains a solid water-soluble polymer, a dissolution inhibitor to the water-soluble polymer and water.
申请公布号 JP2014038906(A) 申请公布日期 2014.02.27
申请号 JP20120179391 申请日期 2012.08.13
申请人 FUJIMI INC 发明人 TAKAHASHI SHUHEI;MORI YOSHIO
分类号 H01L21/304 主分类号 H01L21/304
代理机构 代理人
主权项
地址