发明名称 |
POLISHING COMPOSITION, POLISHING COMPOSITION MANUFACTURING METHOD AND SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD USING POLISHING COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a polishing composition which can inhibit adherence of particles on a polished surface of a polishing object.SOLUTION: A polishing composition contains a solid water-soluble polymer, a dissolution inhibitor to the water-soluble polymer and water. |
申请公布号 |
JP2014038906(A) |
申请公布日期 |
2014.02.27 |
申请号 |
JP20120179391 |
申请日期 |
2012.08.13 |
申请人 |
FUJIMI INC |
发明人 |
TAKAHASHI SHUHEI;MORI YOSHIO |
分类号 |
H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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